Sign In | Join Free | My tjskl.org.cn
China Shenzhen Xinhuo Future Technology Co., Ltd. logo
Shenzhen Xinhuo Future Technology Co., Ltd.
Shenzhen Xinhuo Future Technology Co., Ltd.
Verified Supplier

2 Years

Home > System On Chip (SoC) >

XCVM1802-1LLIVSVA2197

Product Categories
Shenzhen Xinhuo Future Technology Co., Ltd.
Trust Seal
Verified Supplier
Credit Check
Supplier Assessment
Contact Now

XCVM1802-1LLIVSVA2197

Category : Integrated Circuits (ICs) Embedded System On Chip (SoC)

Product Status : Active

Peripherals : DDR, DMA, PCIe

Primary Attributes : Versal™ Prime FPGA, 1.9M Logic Cells

Series : Versal™ Prime

Package : Tray

Mfr : AMD

Supplier Device Package : 2197-FCBGA (45x45)

Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Operating Temperature : -40°C ~ 100°C (TJ)

Architecture : MPU, FPGA

Package / Case : 2197-BFBGA, FCBGA

Number of I/O : 770

RAM Size : 256KB

Speed : 400MHz, 1GHz

Core Processor : Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

Flash Size : -

Description : IC VERSAL AICORE FPGA 2197BGA

Stock : In Stock

Shipping Method : LCL, AIR, Express

Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram

Contact Now

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ System On Chip (SOC) IC Versal™ Prime Versal™ Prime FPGA, 1.9M Logic Cells 400MHz, 1GHz 2197-FCBGA (45x45)
Quality XCVM1802-1LLIVSVA2197 for sale

XCVM1802-1LLIVSVA2197 Images

Inquiry Cart 0
Send your message to this supplier
 
*From:
*To: Shenzhen Xinhuo Future Technology Co., Ltd.
*Subject:
*Message:
Characters Remaining: (0/3000)